NDLI: Edge and extreme edge wafer manufacturing on 200 mm wafer: Methodology, yield challenges, cost effective solutions, limitations

Content Provider	IEEE Xplore Digital Library
Author	Delahaye, B. Baltzinger, J.L. Denis, L. Chantepie, S. Costaganna, P. Richou, G. Lariviere, S. Aonzo, F. Delabriere, S. Poli, F. Bru, C. Meyniel, J.B. Allais, F. Dureuil, V. Raffin, P. Rondey, E.
Copyright Year	2009
Description	Author affiliation: Altis Semiconductor, 224 Bd JF Kennedy, 91105 Corbeil Essonnes, France (Delahaye, B.; Baltzinger, J.L.; Denis, L.; Chantepie, S.; Costaganna, P.; Richou, G.; Lariviere, S.; Aonzo, F.; Delabriere, S.; Poli, F.; Bru, C.; Meyniel, J.B.; Allais, F.; Dureuil, V.; Raffin, P.; Rondey, E.)
Abstract	In this paper we present the methodology for the extreme edge of the wafer qualification for aluminium 0.22 µm embedded EEPROM technology, as Edge Exclusion has moved to 2 mm. Yield challenges, cost effective solutions for the yield edge detractors, process monitoring enhancement and limitations are investigated. We discussed through examples process uniformity for CMP (Chemical Mechanical Polishing), etch or litho processes that we have had to solve. Solutions and limitations are described for nitride residual during planarization process, spacer etch process, and shorts within connection module. Monitoring scheme is evaluated for different techniques with parameters as cost efficiency or time response. This grid has been applied to the monitoring of the improved process with a wide range of confidence level which corresponds to a real difficulty for monitoring the edge and extreme edge of the wafer.
Starting Page	100
Ending Page	105
File Size	596344
Page Count	6
File Format	PDF
ISBN	9781424436149
ISSN	10788743
DOI	10.1109/ASMC.2009.5155965
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-10
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manufacturing Costs Monitoring Etching Qualifications Aluminum EPROM Chemical technology Chemical processes Planarization
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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