NDLI: Molecular insights on interfacial properties and moisture uptake of plastic packaging materials

Content Provider	IEEE Xplore Digital Library
Author	Schen, M.A. Wen-Li Wu Wallace, W.E. Beck-Tan, N. VanderHart, D. Davis, G.T.
Copyright Year	1997
Description	Author affiliation: Mater. Sci. & Eng., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA (Schen, M.A.)
Abstract	Product trends such as chip scale packaging and high density electronic interconnects are driving technologies towards increased complexity and reduced feature sizes. Two particularly important technical challenges involving plastic packages are to enhance the robustness of multi-component material interfaces and to improve the resistance of plastic assemblies to the effects of moisture. This presentation will review recent insights gained at NIST within its electronic packaging, interconnection and assembly program. First, a discussion of the properties and moisture susceptibility of buried polymer interfaces is presented. Using neutron and X-ray reflectivity techniques, NIST can directly measure the CTE and hygroscopic expansion of extremely thin polymer films. Neutron techniques can also yield information about the concentration profile of deuterated water near an interface. Second, results from moisture uptake and egress studies within a molding compound are also presented. Using solid state NMR, NIST can detect different forms of absorbed water and observe how this water responds to changes in the external environment.
Starting Page	85
Ending Page	87
File Size	243729
Page Count	3
File Format	PDF
ISBN	0780338189
DOI	10.1109/ISAPM.1997.581263
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-03-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture NIST Electronics packaging Assembly Neutrons Chip scale packaging Plastic packaging Robustness Polymers Reflectivity
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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