NDLI: A comprehensive study on 40-mil PBGA

Content Provider	IEEE Xplore Digital Library
Author	Chen, R.T. Yukon Chou Ho, T.C. Chiang, P.H. Chien-Chi Chao Wun-Yan Chen
Copyright Year	1997
Description	Author affiliation: ITRI, Taiwan (Chen, R.T.)
Abstract	The 40-mil PBGA is an effective application for higher I/O density. In regular consideration, the pad size and the solder sphere should be smaller due to decreasing the bump pitch from 50 or 60 mils to 40-mil PBGA. Until now, we could not find any standard product or paper which refers to pad size and solder sphere diameter. So we setup this experiment to find out the results and hope it will be useful to build-up the optimal bumping process of 40-mil PBGA. In this study, we considered many different factors such as substrate pad size and solder sphere diameter. In order to find out the best combination of all these factors to achieve the highest manufacturing yield, we applied the thermocouple technology to measure the thermal distribution of the entire substrate in reflow furnace. After bumping the solder ball onto the substrate, we use ball shear test to analyze the force difference between the balls caused by different temperature profile. The shear height and shear speed variables of the ball shear testing are also investigated in this study. The x-section technology was applied in this experiment for examining the bump shape after finishing the bumping process. In this study, we also utilize the noncontact laser technology to examine the bump height after solder bumping process. In order to understand data about SMT application of 40-mil PBGA, the solder joint height with different solder ball diameter and the reliability test data were both included in this experiment. Of course, we design a test board with daisy chain and utilize the x-section technology to achieve the jobs.
Starting Page	62
Ending Page	63
File Size	219877
Page Count	2
File Format	PDF
ISBN	0780338189
DOI	10.1109/ISAPM.1997.581257
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-03-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Manufacturing Thermal variables measurement Thermal factors Furnaces Temperature Shape Finishing Surface-mount technology Soldering
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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