NDLI: Thin film passive components integrated into silicon based multi-chip modules for aerospace applications

Content Provider	IEEE Xplore Digital Library
Author	Kim, N.P. Coates, K.L. Chien, C.-P. Tanielian, M.H.
Copyright Year	1997
Description	Author affiliation: Boeing Defence & Space Group, Seattle, WA, USA (Kim, N.P.)
Abstract	Research and development activities of Boeing embedded passive technologies are described with an emphasis on resistors and capacitors. Both resistor and capacitor technologies are based on thin film processing to be compatible with the current fabrication process for silicon based multi-chip modules. Resistor material systems with two different ranges of resistivity were developed. Candidate materials included TaN/sub x/ for low resistivity and various cermet materials for high resistivity materials. Three different materials systems are being evaluated for embedded capacitors. Single or multi-layer capacitors using SiN/sub x/, and Ta/sub 2/O/sub 5/ based thin film as dielectric are being developed while only a limited study is planned on high permittivity materials. A conceptual process flow for the multi-layering scheme was developed and is being implemented with candidate capacitor materials. This paper will describe experimental results collected along this study.
Starting Page	81
Ending Page	84
File Size	432612
Page Count	4
File Format	PDF
ISBN	0780338189
DOI	10.1109/ISAPM.1997.581262
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-03-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor thin films Silicon Capacitors Dielectric materials Resistors Conductivity Dielectric thin films Research and development Fabrication Ceramics
Content Type	Text
Resource Type	Article

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