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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Xuepeng Li Lehmann, T. |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Electr. Eng. & Telecommun., Univ. of New South Wales, Sydney, NSW, Australia (Xuepeng Li; Lehmann, T.) |
| Abstract | In this paper, an inductive link using an on-chip stacked square receiver coil (outer diameter of approximately 6 mm) is presented. An SOS (silicon on sapphire) process is employed to enhance the biocompatibility and to ensure a possible maximum power transfer. The capacitor used to build the LC tank for the receiver coil is also integrated on chip. With a carrier frequency of approximately 13MHz, the power module was able to reach 21% power transfer efficiency. With no requirement for external capacitors, this finding has shown the potential of fully integrated components with ultra-small size in the application of energy transfer in the field of biomedical implants. |
| Starting Page | 956 |
| Ending Page | 959 |
| File Size | 728494 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479900664 |
| ISSN | 15483746 |
| DOI | 10.1109/MWSCAS.2013.6674809 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-04 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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