NDLI: Investigation of interface orientation and interface mixing in spin valve heterostructures

Content Provider	IEEE Xplore Digital Library
Author	Hyun Sung Joo Atwater, H.A.
Copyright Year	1965
Abstract	We have investigated magnetoresistance properties of (100) epitaxial, (111) textured and polycrystalline spin valve heterostructures on (100) Si substrates by UHV ion beam sputtering at room temperature. Magnetoresistance was measured as a function of Cu interlayer thickness (t/sub i/) with 10 /spl Aring//spl les/t/sub i//spl les/100 /spl Aring/ and the maximum was found at 20 /spl Aring/ in the case of (100) epitaxial spin valves. Highly (111) textured spin valves with heterostructure configurations similar to (100) spin valves were found to have a slightly lower magnetoresistance than (100) heterostructures, but a very similar functional dependence of magnetoresistance on t/sub i/. Interface mixing during the sputtering process by energetic neutral bombardment was found to significantly affect the magnetoresistance. Samples were made under various sputtering conditions (gas pressure, ion beam energy, target and substrate configuration) that could enhance or suppress high energy neutral bombardment of the growing film surface. Samples made under the conditions that suppressed neutral bombardment showed higher magnetoresistance and more abrupt interfaces as confirmed by small angle X-ray diffraction (SAXD) analysis of interface mixing by energetic neutral bombardment during sputter deposition.
Sponsorship	IEEE Magnetics Society
Starting Page	3946
Ending Page	3948
Page Count	3
File Size	339468
File Format	PDF
ISSN	00189464
Volume Number	31
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Magnetoresistance Spin valves Sputtering Substrates Ion beams Magnetic properties Thickness measurement Temperature measurement X-ray diffraction Magnetic analysis
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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