NDLI: The effect of tensile stress on the power loss of 3% grain-oriented silicon-iron

Content Provider	IEEE Xplore Digital Library
Author	Overshott, K. Foot, G.
Copyright Year	1965
Abstract	The domain wall motion and localized power loss have been measured under applied tensile stress for individual grains in polycrystalline commercial grain-oriented silicon-iron. The variation of power loss with tension results show that the greatest reduction in loss occurs at the higher values of frequency and flux density, which is when a large degree of bowing occurs. This reduction in power loss is due to the changes in the extrapolated static hysteresis loss and the excess eddy current (anomalous) loss as the tensile stress is increased. The reduction in hysteresis loss is primarily due to the decrease in wall spacing, whereas the change in anomalous loss is dependent upon the combined change of wall profile and decrease in wall spacing. Certain grains were found to have 50% of power loss of grains of similar thickness, orientation and diameter and the reasons for this low loss are described. It is shown that the application of a tensile stress of 7 MPa causes the greatest decrease in power loss and a further increase in tensile stress only has a marginal effect on the power loss.
Sponsorship	IEEE Magnetics Society
Starting Page	1496
Ending Page	1498
Page Count	3
File Size	247168
File Format	PDF
ISSN	00189464
Volume Number	18
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1982-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tensile stress Power measurement Loss measurement Motion measurement Stress measurement Density measurement Coatings Optical losses Frequency Steel
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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