NDLI: Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling

Content Provider	IEEE Xplore Digital Library
Author	Bing Ji Xueguan Song Sciberras, E. Wenping Cao Yihua Hu Pickert, V.
Copyright Year	1986
Abstract	Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.
Sponsorship	IEEE Power Electronics Society
Starting Page	2493
Ending Page	2504
Page Count	12
File Size	939198
File Format	PDF
ISSN	08858993
Volume Number	30
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Insulated gate bipolar transistors Multichip modules Fatigue Resistance Strain Optimization Stress thermal cycling Aging, fatigue fatigue finite element methods insulated gate bipolar transistors multi-objective optimization methods power cycling reliability thermal cycling (TC) Aging finite-element (FE) methods insulated-gate bipolar transistors (IGBTs) multiobjective power cycling (PC)
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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Lifetime calculation for power modules, application and theory of models and counting methods

Thermal design and transient analysis of insulated gate bipolar transistors of power module

Temperature levels effects on the thermomechanical behaviour of solder attach during thermal cycling of power electronic modules

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Extensive fatigue investigation of solder joints in IGBT high power modules

Influences of DBC metal layout on the reliability of IGBT power modules

Comprehensive investigation on current imbalance among parallel chips inside MW-scale IGBT power modules

Compact thermal model of a three-phase IGBT inverter power module

Electro-thermal modeling of high power IGBT module short-circuits with experimental validation

Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling

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