NDLI: A circuit-design approach for enhancing the yield of complex iterative integrated electronic subsystems

Content Provider	IEEE Xplore Digital Library
Author	Ragonese, L.J.
Copyright Year	1963
Abstract	Since the preselection of individual components is impossible in integrated electronics, component parameters are, in general, characterized by nontruncated probability density functions which reflect the accuracy of the manufacturing process. The significant thermal resistance in practical integrated electronic sub-systems causes temperature gradients which further increase the effective standard deviation of component parameter probability density functions. As ever increasing numbers of components are constrained to ever decreasing volume, the temperature gradient can cause profound effects including the seeming paradox of a decrease in subsystem yield with increasing design range in parameter values. This paper proposes a straightforward and flexible approach, primarily applicable to digital circuits, which results in a circuit design which is directly related to the functional performance requirements, the accuracy of the manufacturing process, the thermal characteristics of the packaging scheme, and which results in a subsystem with enhanced probability of functioning correctly when fabricated. The approach can make use of any valid "worst-case" design procedures presently available for given topologies provided that the "worst-case" limits are picked in a specific unusual way which is described.
Sponsorship	IEEE Publication
Starting Page	1613
Ending Page	1616
Page Count	4
File Size	405082
File Format	PDF
ISSN	00189219
Volume Number	52
Issue Number	12
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1964-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit yield Iterative methods Probability density function Manufacturing processes Thermal resistance Temperature distribution Digital circuits Circuit synthesis Electronic packaging thermal management Topology
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

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