NDLI: High-Fill-Factor Micromirror Array With Hidden Bimorph Actuators and Tip

Content Provider	IEEE Xplore Digital Library
Author	Kemiao Jia Samuelson, S.R. Huikai Xie
Copyright Year	1992
Abstract	This paper presents the design, fabrication, packaging, and characterization of a novel high-fill-factor micromirror array (MMA) actuated by electrothermal bimorphs. In this paper, 4 × 4 MMA devices with an 88% area fill factor at normal incidence, 1.5 mm × 1.5 mm subaperture size, and single-crystal-silicon-supported mirror plates have been fabricated based on a single silicon-on-insulator wafer, without additional bonding/transfer processes. The bimorph actuators are hidden underneath the mirror plates, which are also protected by silicon walls. The MMA devices can directly be surface mounted onto driving circuit chips or printed circuit boards after fabrication. The subapertures can generate large tip-tilt-piston scanning and can individually be addressed. Static characterizations of the packaged devices show that each subaperture can achieve a piston stroke of ~310 μm and optical deflection angles greater than ±25° in both the x- and y-axes, all at 8-V dc. The preliminary laser-steering optical-phased-array capability of the obtained MMA device has also experimentally been demonstrated. This paper is based on the conference proceedings presented at the 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010), Hong Kong.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	573
Ending Page	582
Page Count	10
File Size	1400140
File Format	PDF
ISSN	10577157
Volume Number	20
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Actuators Silicon Micromirrors Optical device fabrication Apertures surface mounting Bimorph flip-chip packaging microelectromechanical systems (MEMS) micromirror micromirror array (MMA) microoptoelectromechanical systems (MOEMS) optical phased array (OPA)
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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