NDLI: Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications

Content Provider	IEEE Xplore Digital Library
Author	Sung Chul Joo Baldwin, D.F.
Copyright Year	1999
Abstract	Nano-particle silver (NPS) conductors are increasingly being investigated for package level electronics applications. Unlike traditional thick film materials and conductive inks, nano-particle conductors often do not incorporate compounds to promote interfacial adhesion such as binders used in thick films and polymer adhesives used in conductive inks as these adhesion promoters can degrade the electrical performance. The NPS is concerned with low adhesion to most of processed polymer surface such as liquid crystal polymer (LCP), polyimide, and benzocyclobutene (BCB). Moreover, the adhesion mechanism of NPS has not been identified yet. Thus, as a first step to identify NPS adhesion mechanism and thus, to improve NPS adhesion, quantitative measurement of the adhesion strength of NPS is necessary. Since conventional adhesion test methods are not directly applicable to thin (~ 2 ¿m) NPS film adhesion test, a new adhesion test method is developed in this paper to estimate the adhesion strength of NPS films. The newly developed adhesion test method is called modified button shear test (MBST) because it modifies the conventional button shear test and integrates the generally known die shear test. The MBST is used for measuring not only interfacial bond strength, but also interfacial fracture energy. The interfacial bond strength in tension and the interfacial fracture energy of NPS with LCP substrate measured by MBST are 24.4 MPa and 17.2 J/m², respectively. The MBST is generic in nature and can be extended to other thin films adhesion test for measuring interfacial bond strength and interfacial fracture energy.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	48
Ending Page	57
Page Count	10
File Size	2166169
File Format	PDF
ISSN	15213323
Volume Number	33
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Silver Electronics packaging Testing Conducting materials Liquid crystal polymers Energy measurement Bonding Thick films Ink nano-particle silver Adhesion button shear die shear electronics packaging interfacial bond strength interfacial fracture interfacial fracture energy
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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