NDLI: Molded Substrates for Inkjet Printed Modules

Content Provider	IEEE Xplore Digital Library
Author	Miettinen, J. Kaija, K. Mantysalo, M. Mansikkamaki, P. Kuchiki, M. Tsubouchi, M. Ronkka, R. Hashizume, K. Kamigori, A.
Copyright Year	1999
Abstract	Ever increasing demand for high-performance, miniaturized, low-cost, and more environmentally conscious targets set high requirements for electronics packaging and manufacturing. Digital drop-on-demand printing of materials is an interesting approach for electronics manufacturing allowing several advantages compared to subtractive methods to manufacture electronics. Additive processing by means of digital printing offers new possibilities to electronics integration, by enabling direct writing on even nonplanar surfaces, and interconnection without specific substrate for components. A module utilizing additive deposition of conductive metallic nanoparticle inks and dielectrics using inkjet printing was designed. Conventional laminate-based or ceramic interconnection substrate, i.e., printed wiring boards was not used as often in electronics modules. Chip-first modules made using a particular encapsulation method were constructed of molded substrate with embedded components and without any wiring. The molding process and the characteristics of molding material were examined using real product samples, material characterization methods, and modeling. The interconnection process using inkjettable metallic nanoparticle and dielectric inks set strict requirements for molding materials; the surface characteristics should be suitable for the inkjetting of conductive and dielectric materials. Additionally, material must withstand the harsh process conditions that include several heating cycles in relatively high temperatures for organic materials. The surface characteristics of the molding material should be adjusted to ensure good control of inkjetted fluids on a surface enabling high-yield inkjetting of fine-pitch patterns. Furthermore, the mechanical properties of molding material and molding material surface have an effect on the interconnection process yield and reliability of the inkjetted lines and interconnections. The characteristics of molded modules working as substrate for additively processed patterns is a crucial role in the manufacturing of a highly integrated printed module.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	293
Ending Page	301
Page Count	9
File Size	1262592
File Format	PDF
ISSN	15213331
Volume Number	32
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric materials Dielectric substrates Conducting materials Manufacturing Printing Additives Ink Wiring Organic materials Electronics packaging system-in-package (SiP) Dielectric ink inkjet (IJ) nanoparticle ink printable electronics
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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