NDLI: Advanced packaging of integrated passive devices for RF applications

Content Provider	IEEE Xplore Digital Library
Author	Logan, E.A. Clearfield, H.M. Young, J.L. Bolton, D.H.
Copyright Year	1998
Description	Author affiliation: Intarsia Corp., Fremont, CA, USA (Logan, E.A.)
Abstract	Modern RF and wireless systems, in particular the portable and handheld consumer devices, are placing huge demands on component and assembly technologies. The integration of many different functions into one unit means that the component count has become very large. Since passive components form the majority of the devices mounted on the circuit board, there is considerable incentive to identify ways of reducing the number and/or size of these devices without compromising system performance. Interest is now focusing on the role that integrated passive devices (IPDs) can play in achieving some of these aims and a number of new approaches are emerging in this field. Integrated passive devices can provide a large number of passive components and functional blocks within a single device, reducing the overall complexity at the board level and improving the ease of assembly. In order to be effective, however, both the manufacturing and packaging technologies need to be selected to optimize performance, areal density and cost. Chip-scale packaging, combined with a thin film passive device technology and a large area format manufacturing capability offers a solution to these issues, as well as providing a package form factor compatible with existing surface mount assembly operation. This paper describes the thin film integrated passive technology and chip-scale packaging techniques which are being used to produce small outline, high performance integrated passive devices for use in a range of RF, wireless and digital applications.
Starting Page	289
Ending Page	292
File Size	704238
Page Count	4
File Format	PDF
ISBN	0780349881
DOI	10.1109/RAWCON.1998.709193
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-08-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Chip scale packaging Thin film devices Assembly systems Integrated circuit technology Printed circuits System performance Components, packaging, and manufacturing technology Cost function Surface-mount technology
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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