NDLI: High-<emphasis>Q</emphasis> Embedded Passives on Large Panel Multilayer Liquid Crystalline Polymer-Based Substrate

Content Provider	IEEE Xplore Digital Library
Author	Yun, W. Sundaram, V. Swaminathan, M.
Copyright Year	1999
Abstract	This paper presents high-Q embedded passives on a multilayer liquid crystalline polymer (M-LCP)-based substrate for a low-profile, compact, mixed-signal system integration with high performance. A low loss and a low water absorption are advantages of LCP. It is also lower-cost material than other high-frequency materials such as low-temperature cofired ceramic (LTCC) due to its compatibility to printed wiring board (PWB) process. Low loss characteristics of LCP provide high-Q passives such as inductors, capacitors, and matching networks. Seventy-six inductors and sixteen capacitors were characterized from three different 9 in times 12 in multilayer LCP panels. Two different locations from each board were chosen to preliminarily validate the large panel process of the M-LCP substrate. The highest quality factor (Q) of 164 was achieved with 2.55 nH at 5.05 GHz. The inductors range from 1.45 to 23.11 nH and Qs range from 43 to 164. Inductors in various embedded layers were characterized for realization of 3-D integration in multilayer LCP substrate for multiband applications. To remove the parasitics from pads and interconnections, a two-step de-embedding technique was applied. The model-to-hardware correlations are presented in this paper. Twelve 3-D capacitors were also designed and characterized, which provide more than double the capacitance of standard capacitors. Low-loss filters and baluns at 5 GHz were simulated and measured using the designed high-Q passives. The designed high-Q embedded passives on M-LCP-based substrates provide a systematic 3-D integration method for achieving low-profile, high-performance, and compact modules.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	580
Ending Page	591
Page Count	12
File Size	2177591
File Format	PDF
ISSN	15213323
Volume Number	30
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Inductors Capacitors Nonhomogeneous media Crystalline materials Crystallization Liquid crystal polymers Absorption Ceramics Wiring Q factor three-dimensional (3-D) integration Embedded passives high-$Q$ liquid crystalline polymer (LCP) multilayer
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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