NDLI: Direct Encapsulation of Organic Light-Emitting Devices (OLEDs) Using Photo-Curable <emphasis>co</emphasis>-Polyacrylate/Silica Nanocomposite Resin

Content Provider	IEEE Xplore Digital Library
Author	Wang, Y.-Y. Hsieh, T.-E. Chen, I.-C. Chen, C.-H.
Copyright Year	1999
Abstract	Direct encapsulation of organic light-emitting devices (OLEDs) was realized by using highly transparent, photo-curable co-polyacrylate/silica nanocomposite resin. Feasibility of such a resin for OLED encapsulation was evaluated by physical/electrical property analysis of resins and driving voltage/luminance/lifetime measurement of OLEDs. Electrical property analysis revealed a higher electrical insulation of photocured nanocomposite resin film at 3.20times10¹² Omega in comparison with that of oligomer film at 1.18times10¹² Omega at 6.15 V to drive the bare OLED. This resulted a lower leakage current and the device driving voltage was efficiently reduced so that the nanocomposite-encapsulated OLED could be driven at a lower driving voltage of 6.09 V rather than 6.77 V for the oligomer-encapsulated OLED at the current density of 20 mA/cm². Luminance measurement revealed a less than 1.0% luminance difference of OLEDs encapsulated by various types of resins, which indicates that the photo-polymerization takes very little effect on the light-emitting property of OLEDs. Lifetime measurement of OLEDs found that , the time span for the normalized luminance of device drops to 80%, for nanocomposite-encapsulated OLED is 350.17 h in contrast to 16.83 h for bare OLED and 178.17 h for the oligomer-encapsulated OLED. This demonstrates that nanocomposite resin with optimum properties is feasible to OLED packaging and a compact device structure could be achieved via the method of direct encapsulation.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	421
Ending Page	427
Page Count	7
File Size	1927825
File Format	PDF
ISSN	15213323
Volume Number	30
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Encapsulation Organic light emitting diodes Resins Nanoscale devices Voltage Lifetime estimation Silicon compounds Dielectrics and electrical insulation Leakage current Current density photo-curable nanocomposite resin Direct encapsulation organic light-emitting devices (OLEDs)
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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