NDLI: Novel approach of twin-side thermal interfacing of integrated power modules for reduced thermal impedance

Content Provider	IEEE Xplore Digital Library
Author	Jie Chang Changming Liao
Copyright Year	1986
Abstract	A novel approach of twin-side thermal interfaces of integrated power modules (IPM) is presented. This approach applies and improves commercially off-the-shelf products of IPM without significantly changing the original packaging design and manufacture's fabrication process. This approach can reduce the equivalent thermal impedance of the power module by about 20 %. It, in turn, reduces the p-n junction temperature rise of the power devices inside by 20 % at an equivalent load, thus being able to increase ambient operating temperatures, which is desirable for automotive applications. In addition, the weight and volume associated with conventional cooling mechanism can be reduced
Sponsorship	IEEE Power Electronics Society
Starting Page	625
Ending Page	632
Page Count	8
File Size	1313019
File Format	PDF
ISSN	08858993
Volume Number	21
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Multichip modules Impedance Temperature Electronic packaging thermal management Pulse width modulation inverters Pulse width modulation converters Hybrid electric vehicles Thermal loading Manufacturing processes Automotive applications twin-side thermal interfaces Automotive power electronics elevated temperature operations integrated power modules (IPMs) maximum rated junction temperature p–n junction temperature rise
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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