NDLI: Gold dendrite simulation: root cause determination

Content Provider	IEEE Xplore Digital Library
Author	Kersey Jr., J. Blish II, R.C.
Copyright Year	2001
Abstract	While dendritic growth for Ag, Sn, and other metals provides jeopardy for the exterior of packaged integrated circuits, we observed Au dendrites inside ceramic packages. The key factors controlling growth kinetics are a combination of bias and two residual chemicals: one hygroscopic component from the die attach material, and gold plating salts. We found dendritic growth rate to be linear with plating salt concentration during laboratory simulations, but were unable to measure the current density dependence. However, the key factor was the presence or absence of residual nonylphenol, tracked down to an inadequate die attach bake schedule. Laboratory simulations produced the same dendrite morphology as seen for failed units. Furthermore, we found dendritic growth would occur only if all three factors were present-bias, nonylphenol, and the plating salts.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	189
Ending Page	191
Page Count	3
File Size	182844
File Format	PDF
ISSN	15304388
Volume Number	4
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Circuit simulation Integrated circuit packaging Microassembly Laboratories Tin Ceramics Kinetic theory Chemicals Density measurement
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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