NDLI: Initiation and propagation of delaminations at the underfill/passivation interface relevant to flip-chip assemblies

Content Provider	IEEE Xplore Digital Library
Author	McAdams, B.J. Pearson, R.A.
Copyright Year	2001
Abstract	A crucial reliability issue for flip-chip microelectronic assemblies is the mechanical integrity of the various bi-material interfaces present. Understanding the mechanics and physics of adhesion is continually reiterated in the International Technology Roadmap for Semiconductors (ITRS). With current trends in the microelectronics industry pushing for smaller and smaller feature sizes, small-scale delamination and initiation are becoming more of a focus in adhesion studies. Our work looks at the application of a stress singularity approach to the initiation problem at various geometric singularities found at interfaces in flip-chip assemblies. Moreover, we compare the adhesion of the same interfaces using standard fracture mechanics. Specifically, several underfill/polyimide interfaces are tested, in both a standard double cantilever beam geometry and a tensile butt joint geometry. The results show a direct correlation between stress intensity values for both the initiation of delaminations and the propagation of existing delaminations. Modified tensile butt joint geometry testing shows an inverse relationship between singularity strength and overall joint strength.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	169
Ending Page	175
Page Count	7
File Size	532412
File Format	PDF
ISSN	15304388
Volume Number	4
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delamination Passivation Assembly Adhesives Geometry Microelectronics Tensile stress Testing Physics Polyimides
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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