NDLI: The surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon

Content Provider	IEEE Xplore Digital Library
Author	Sangwoo Lee Sangjun Park Cho, D.-I.
Copyright Year	1992
Abstract	This paper presents the surface/bulk micromachining (SBM) process to allow fabricating released microelectromechanical systems using bulk silicon. The process starts with a [111]-oriented silicon wafer. The structural patterns are defined using the reactive ion etching technique used in surface micromachining. Then the patterns, as well as sidewalls, are passivated with an oxide film, and bare silicon is exposed at desired areas. The exposed bare silicon is further reactive ion etched, which defines sacrificial gap dimensions. The final release is accomplished by undercutting the exposed bulk silicon sidewalls in aqueous alkaline etchants. Because {111} planes are used as etch stops, very clean structural surfaces can be obtained. Using the SBM process, 5-, 10-, and 100-/spl mu/m-thick arbitrarily-shaped single crystal silicon structures, including comb-drive resonators, at 5-, 30-, and 100-/spl mu/m sacrificial gaps, respectively, are fabricated. An electrostatic actuation method using p-n junction isolation is also developed in this paper, and it is applied to actuate comb-drive resonators. The leakage current and junction capacitance of the reversed-biased p-n junction diodes are also found to be sufficiently small for sensor applications. The developed SBM process is a plausible alternative to the existing micromachining methods in fabricating microsensors and microactuators, with the advantage of using single crystal silicon.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	409
Ending Page	416
Page Count	8
File Size	578628
File Format	PDF
ISSN	10577157
Volume Number	8
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromachining Silicon Etching P-n junctions Microelectromechanical systems Semiconductor films Surface cleaning Electrostatic actuators Leakage current Capacitance
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Surface/bulk micromachining (SBM) process and deep trench oxide isolation method for MEMS

Electrostatic actuation of surface/bulk micromachined single-crystal silicon microresonators

Surface/bulk micromachined single-crystalline-silicon micro-gyroscope

Process Development for CMOS-MEMS Sensors With Robust Electrically Isolated Bulk Silicon Microstructures

A MEMS Device for Studying the Friction Behavior of Micromachined Sidewall Surfaces

Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

Uncooled Thermoelectric Infrared Sensor With Advanced Micromachining

A Robust RF MEMS Variable Capacitor with Piezoelectric and Electrostatic Actuation

Surface-micromachining processes for electrostatic microactuator fabrication

The surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon

Similar Documents

Surface/bulk micromachining (SBM) process and deep trench oxide isolation method for MEMS

Electrostatic actuation of surface/bulk micromachined single-crystal silicon microresonators

Surface/bulk micromachined single-crystalline-silicon micro-gyroscope

Process Development for CMOS-MEMS Sensors With Robust Electrically Isolated Bulk Silicon Microstructures

A MEMS Device for Studying the Friction Behavior of Micromachined Sidewall Surfaces

Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

Uncooled Thermoelectric Infrared Sensor With Advanced Micromachining

A Robust RF MEMS Variable Capacitor with Piezoelectric and Electrostatic Actuation

Surface-micromachining processes for electrostatic microactuator fabrication

The surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon