NDLI: Yield prediction for flip-chip solder assemblies based on solder shape modeling

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Yield prediction for flip-chip solder assemblies based on solder shape modeling

Content Provider	IEEE Xplore Digital Library
Author	Tower, S.C. Bingzhi Su Lee, Y.C.
Copyright Year	1999
Abstract	A model has been developed to predict the yield of flip-chip solder assemblies based on calculated solder shapes. It is a physical model considering a limited number of physical factors such as the mean and the standard deviation of the solder volume distribution, the assembly warpage, the die size, and the number of inputs/outputs (I/O's). The main features of the model are: (1) the quick calculation of the solder height of every solder joint out of hundreds or thousands of connections; (2) the definition of failure criteria to determine the assembly yield. The quick calculation is accomplished by the use of a force model to estimate molten solder's normal reaction force corresponding to the solder's height, volume, circular pad diameter and surface tension coefficient. The failure criteria are height limits determined using surface evolver, which is a public tool for solder shape estimation. Outside the height limits, it is difficult to achieve convergent solutions; therefore, the limits are chosen as failure criteria since they implied large potential manufacturing variations in solder shapes. To illustrate the modeling capability, a case with 1 cm/spl times/1 cm chip, 1024 I/O's is studied. The model shows that a standard deviation of 25% for 4.48 e/sup -7/ cm/sup 3/ mean solder volume produces low yields. The variance of 19% for 4.48 e/sup -7/ cm/sup 3/ is required for a 100% yield.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	29
Ending Page	37
Page Count	9
File Size	397993
File Format	PDF
ISSN	1521334X
Volume Number	22
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Shape Predictive models Process control Process design Poles and towers Soldering Packaging Data engineering Temperature
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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