NDLI: Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

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Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

Content Provider	IEEE Xplore Digital Library
Author	Johnson, R.W. Palmer, M.J. Bozack, M.J. Isaacs-Smith, T.
Copyright Year	1999
Abstract	As the laminate substrate industry moves from hot air solder level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium, and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlayer, were evaluated from two vendors. In each case, a thin gold passivation layer was deposited by immersion plating over the palladium. The initial evaluation criteria included bondability (number of missed bonds and flame off errors), wire pull strength, standard deviation, bond failure mode, and visual inspection. The bonding window was determined by independently varying force (four levels), power (four levels), and time (two levels). The stage temperature was maintained at 150/spl deg/C, compatible with BT laminate material. Different preconditioning environments such as a solder reflow cycle, high temperature storage (125/spl deg/C) and humidity storage (85%RH/85/spl deg/C) on initial bondability were also considered. Rutherford backscattering and Auger analysis were used to examine the surface finishes. The stability of the bonds was investigated by high temperature storage (125/spl deg/C) with periodic electrical resistance and pull strength testing.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	7
Ending Page	15
Page Count	9
File Size	357040
File Format	PDF
ISSN	1521334X
Volume Number	22
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Wire Bonding Laminates Palladium Temperature Nickel Silver Passivation Fires
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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