NDLI: The importance of material selection for flip chip on board assemblies

Content Provider	IEEE Xplore Digital Library
Author	O'Malley, G. Giesler, J. Machuga, S.
Copyright Year	1994
Abstract	Flip Chip On Board (FCOB) technology, where the unpackaged silicon chip is assembled directly to an organic substrate, provides an unique interconnect structure that significantly reduces the substrate area required by traditional through hole or surface mount integrated circuit packages. Without the protection for the chip that a package body affords however, reduced mechanical robustness and a decrease in reliability performance are potential concerns. In addition, the inherent thermal mismatch between the chip and substrate, particularly with an organic printed circuit board, will produce an accumulation of stress in the solder joints under normal operating conditions that can result in relatively premature failures due to solder fatigue. Coupling the chip and substrate together with an encapsulation material under the chip face has successfully overcome these mechanical and reliability issues. However, the success of the encapsulation is dependent on many factors. Among these are the encapsulant's material properties, and the compatibility with the chip and substrate surfaces. Thus, the selection of the basic materials to be used in the FCOB assembly are interrelated and critical to achieving the desired performance from the completed assembly. This paper highlights the key considerations involved in the identification of suitable materials for each of the basic constituent elements: printed circuit board (PCB), silicon chip and encapsulation material.<>
Sponsorship	IEEE Computer Society
Starting Page	248
Ending Page	255
Page Count	8
File Size	888733
File Format	PDF
ISSN	10709894
Volume Number	17
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Assembly Encapsulation Silicon Integrated circuit packaging Thermal stresses Printed circuits Integrated circuit technology Surface-mount technology Integrated circuit interconnections
Content Type	Text
Resource Type	Article
Subject	Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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