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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chapman, Q.H. Carr, L.S. Syrzycki, M.J. Dufort, B. |
| Copyright Year | 1994 |
| Abstract | A chip sized test vehicle has been created to experiment with the technology and design required for two wafer scale thermal pixel displays: a thermal pixel dynamic scene simulator and a visual-to-thermal converter. The 4.7/spl times/4.7 mm device contains a 2/spl times/4 array of micromachined thermal pixels, optical detectors, A/D converters, digital pixel control circuitry, and laser links for interconnection. Laser produced defect avoidance schemes allowed testing and harvesting for global redundancy of the control circuitry and local transducer substitution. Also the laser linked signal buses flexibility was used to arrange the chip in different thermal pixel display configurations. Two chips were laser interconnected, one as fabricated and another where anisotropic etching had created a suspended plate holding the polysilicon resistor thermal pixels. From the electrical and laser interconnection points of operation there was no difference between the etched and unetched circuits.< |
| Sponsorship | IEEE Computer Society |
| Starting Page | 334 |
| Ending Page | 341 |
| Page Count | 8 |
| File Size | 994882 |
| File Format | |
| ISSN | 10709894 |
| Volume Number | 17 |
| Issue Number | 3 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1994-08-01 |
| Publisher Place | U.S.A. |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Layout Integrated circuit interconnections Displays Optical arrays Optical control Circuit testing Etching Vehicle dynamics Circuit simulation Sensor arrays |
| Content Type | Text |
| Resource Type | Article |
| Subject | Engineering |
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