NDLI: Molded hybrid IC packages

Content Provider	IEEE Xplore Digital Library
Author	Biswas, R. Curtis III, H. Deane, P.A. Marinis, T.F.
Copyright Year	1978
Abstract	A family of plastic molded packages that conform to JEDEC standards for hybrid IC applications is being developed by providing a number of benefits. System design is simplified because standard CAD (computer-aided design) libraries can be utilized to determine part location, routing, solder pad dimensions, and electrical characteristics of the package. Manufacturability is improved because industry standard equipment can be used for electrical testing, component placement, solder reflow, cleaning, and inspection. Overall system reliability is improved because circuit boards can be manufactured using standardized components, equipment, and processes that are better characterized and controlled. The mechanical reliability of QUAD packages with 68 and 124 leads on 50-mil pitch and 132 leads on 25-mil pitch has been investigated. Results indicate that all three of these molded packages can withstand several hundred temperature cycles from -40 degrees C to 130 degrees C without any degradation of their mechanical integrity.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	514
Ending Page	520
Page Count	7
File Size	950958
File Format	PDF
ISSN	01486411
Volume Number	12
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Hybrid integrated circuits Integrated circuit packaging Packaging machines Design automation Lead Plastic integrated circuit packaging Standards development Application specific integrated circuits Application software Libraries
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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