NDLI: New Packaging Strategy to Reduce System Costs

Content Provider	IEEE Xplore Digital Library
Author	Balde, J.
Copyright Year	1978
Abstract	Packaging density for mid-sized computers, personal computers, and other cost-performance equipment has been limited by the need to use available interface or "glue" circuit chips. This makes the system and circuit boards DIP dominated, with a continuing lower circuit density than achieved by bigger main frame systems. Using the percent active silicon area yardstick, various multichip package strengths are explored, showing that there is an increase in board efficiency for easily achievable package constructions that are possible with open plastic premolded packages. Packages are shown that demonstrate that this approach is available whenever the systems manufacturers and the integrated circuit (IC) houses decide to set up the necessary standard packages.
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	257
Ending Page	260
Page Count	4
File Size	999165
File Format	PDF
ISSN	01486411
Volume Number	7
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1984-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Packaging machines Plastic integrated circuit packaging Plastic packaging Integrated circuit packaging Computer interfaces Microcomputers Printed circuits Electronics packaging Silicon
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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