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Diffusion and structural changes in microcircuit interconnections
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Nowak, W. B. |
| Copyright Year | 1973 |
| Description | The interdiffusion of platimum and gold films, a couple utilized in beam lead microcircuits, has been studied for temperatures up to 550 C. Gold-on-platinum couples and separate platimum and gold films 80-450 nm thick, were deposited by electron beam evaporation onto oxidized (111) silicon substrates. Diffusion was monitored by means of spectral reflectance versus wavelength in the band 500-1000 nm. The separate metal films showed good adhesion and stable reflectances (after an initial change) for at least 6 h at diffusion temperatures, in contrast to the couples. Analysis of platinum diffusion through the gold films yielded an activation energy about 38 kcal/g-atom and a pre-exponential factor of the order 0.001 sq cm/sec, values close to those for volume diffusion. The pre-exponential factor especially is dependent upon film deposition conditions. |
| File Size | 309129 |
| Page Count | 10 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19740005792 |
| Archival Resource Key | ark:/13960/t1dk06g1w |
| Language | English |
| Publisher Date | 1973-09-07 |
| Access Restriction | Open |
| Subject Keyword | Electronics Thin Films Gold Vapor Deposition Semiconducting Films Metal Films Platinum Semiconductor Junctions Failure Modes Surface Diffusion Microelectronics Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
