Loading...
Please wait, while we are loading the content...
Similar Documents
High density electronic packaging module with improved cooling assembly
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1971 |
| Description | Cold plate increases heat transfer within high density electronic module. Tapered pins improve heat transfer process by providing larger surface pressure with increased planar area. Cooling technique increases thermal contact where planar area is limited, interface pressure increases the heat transfer coefficient. |
| File Size | 82450 |
| Page Count | 2 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19710000087 |
| Archival Resource Key | ark:/13960/t3324pq6b |
| Language | English |
| Publisher Date | 1971-04-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Components And Circuits Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
