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Ceramic wiring board increases packaging density of electronic modules
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1971 |
| Description | Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers. |
| File Size | 86750 |
| Page Count | 1 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19710000083 |
| Archival Resource Key | ark:/13960/t1tf4jn90 |
| Language | English |
| Publisher Date | 1971-04-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Components And Circuits Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |