Loading...
Please wait, while we are loading the content...
Similar Documents
Piggy-back mounting would increase microcircuit packaging density
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1968 |
| Description | Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit. |
| File Size | 98967 |
| Page Count | 2 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19680000114 |
| Archival Resource Key | ark:/13960/t0fv39r7j |
| Language | English |
| Publisher Date | 1968-04-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Components And Circuits Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |