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Reparable, high-density microelectronic module provides effective heat sink
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1967 |
| Description | Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means. |
| File Size | 637738 |
| Page Count | 2 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19670000356 |
| Archival Resource Key | ark:/13960/t21c6qr84 |
| Language | English |
| Publisher Date | 1967-10-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Components And Circuits Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |