NDLI: Thermal Transport in Graphene Supported on Copper

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chen, Liang Kumar, Satish
Copyright Year	2012
Abstract	The present study investigates the thermal transport in suspended graphene and graphene supported on copper substrate using equilibrium molecular dynamics simulations, Green-Kubo method and relaxation time approximation (RTA) approach. The thermal coupling between graphene and copper substrate was investigated by varying the interaction strength between the carbon atoms and Cu atoms at the interface. The contribution of different phonon modes to the thermal conductivity of suspended and supported graphene was analyzed in order to elucidate the graphene-substrate thermal interactions. The thermal conductivity of graphene decreases with the increasing strength of the interfacial interaction. The analysis shows that the interactions with copper substrate can reduce the thermal conductivity by up to 44%. The decrease of thermal conductivity is primarily due to the suppression of contribution from out-of-plane acoustic (ZA) phonons in the large wave vector region.
Sponsorship	Nanotechnology Institute
Starting Page	761
Ending Page	767
Page Count	7
File Format	PDF
ISBN	9780791854778
DOI	10.1115/MNHMT2012-75075
Conference Proceedings	ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer
Language	English
Publisher Date	2012-03-03
Publisher Place	Atlanta, Georgia, USA
Access Restriction	Subscribed
Subject Keyword	Relaxation (physics) Approximation Graphene Equilibrium (physics) Phonons Atoms Thermal conductivity Acoustics Molecular dynamics simulation Copper Carbon Waves
Content Type	Text
Resource Type	Article

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