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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Fukutani, Kazuhiko Shakouri, Ali |
| Copyright Year | 2005 |
| Abstract | The use of bulk thermoelectric (TE) coolers for thermal management of integrated circuit (IC) chips is analyzed by a detailed electrothermal model. Various ideal and non-ideal parameters that affect the maximum cooling performance are discussed. Thermal resistance between the hot side of the thermoelectric module and ambient is a key parameter determining maximum heat dissipation in the IC chip if its temperature should be kept below a critical value. We show that the thermoelectric geometry factor (the ratio of the leg’s cross sectional area to its length) and the TE module operating current can be optimized to significantly increase the maximum power dissipation. There is an optimum leg thickness that gives the highest cooling power density to the IC chip and further thinning of the TE module will degrade the performance. The optimum thickness and the corresponding maximum cooling power density are calculated. The effect of various material properties are also discussed. |
| Sponsorship | Heat Transfer Division and Electronic and Photonic Packaging Division |
| Starting Page | 2179 |
| Ending Page | 2183 |
| Page Count | 5 |
| File Format | |
| ISBN | 0791842002 |
| DOI | 10.1115/IPACK2005-73410 |
| e-ISBN | 0791837629 |
| Volume Number | Advances in Electronic Packaging, Parts A, B, and C |
| Conference Proceedings | ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference |
| Language | English |
| Publisher Date | 2005-07-17 |
| Publisher Place | San Francisco, California, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Equivalent circuit models Thermoelectric coolers Bulk thermoelectric modules Package thermal resistance Power density Temperature Cooling Circuits Coolers Optimization Geometry Integrated circuits Heat Thermal resistance Energy dissipation Materials properties Thermal management |
| Content Type | Text |
| Resource Type | Article |
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