NDLI: Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Lakhkar, Nikhil Banerjee, Arijit Refai-Ahmed, Gamal Agonafer, Dereje
Copyright Year	2009
Abstract	The advancement made in portable electronic systems has primarily been due to miniaturization of electronic devices. This results in an increase in power density that leads to higher temperatures and formation of hot spots. There is a temperature specification of system surfaces for human comfort (such as the surface close to a keyboard on laptops). The challenge of cooling portable devices is that there is not enough room to accommodate heat sinks. It is therefore important to have heat spreaders that can transfer the heat from critical devices to regions where cooling is available. Traditionally, copper has been the best heat spreader due to its high thermal conductivity. However, copper has a relatively high density and correspondingly high weight. Graphite is a suitable alternative. Recent advances in graphite technology have resulted in fairly high conductivity in the planar directions. In spite of these advances, the cost of graphite is an issue. In this paper, a multi-objective optimization is utilized that considers weight of the graphite heat spreader as objective functions. The data is then compared to published data that utilizes graphite in a laptop.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	571
Ending Page	578
Page Count	8
File Format	PDF
ISBN	9780791843604
DOI	10.1115/InterPACK2009-89341
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Flat heat pipes Power density Temperature Cooling Pareto optimization Density Heat Laptop computers Electronic systems Weight (mass) Graphite Thermal conductivity Copper Heat sinks
Content Type	Text
Resource Type	Article

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