NDLI: Nonlinear Response of a Printed Circuit Board in Shock

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Vujosevic, M. Raghavan, P. Ramanathan, G. Hezeltine, W. Blue, K.
Copyright Year	2009
Abstract	This work focuses on deformation mechanisms taking place in a Printed Circuit Board (PCB) exposed to high impact shock. A combined experimental, theoretical, and numerical approach has been applied to address both the nature of the observed deformation and its modeling and test metrology implications. Experimental evidence overwhelmingly indicates that a PCB in both test and system applications undergoes nonlinear deformations. Geometric nonlinearity of board response is attributed to the elevated in-plane (membrane) stresses that develop when a drop height and/or inertia forces are significant. The impact of these stresses on deformations (board strain) was quantified using a specially designed test. Membrane stresses were also accounted for in a numerical (Finite Element Method) model developed and carefully validated in the course of this study. The model shows a very good agreement with test data. The nonlinearity of PCB deformation in shock, i.e. the fact that both bending moments and in-plane forces are present in the board has important implications on test metrology development and on correlation between the measured board strain and stresses in interconnects of surface mounted components. Of special importance is the impact that nonlinearity can have on development of transfer functions between strain measurements on system boards and strain measurements on test boards, which is also addressed in the paper.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	45
Ending Page	54
Page Count	10
File Format	PDF
ISBN	9780791843604
DOI	10.1115/InterPACK2009-89094
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Membranes Printed circuit boards Deformation Inertia (mechanics) Transfer functions Metrology Strain measurement Shock (mechanics) Finite element methods Modeling Stress Lumber
Content Type	Text
Resource Type	Article

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