NDLI: Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Levi, A. Campbell Michael, J. Ellsworth Arvind, K. Sinha
Copyright Year	2009
Abstract	IBM returned to indirect (cold plate) water cooling in 2008 with the introduction of the Power 575 Supercomputing Node [1]. The node, packaged in a super-dense 2U (88.9 mm) form factor, contains 16 dual core processor modules. An assembly of 16 cold plates was developed to cool the processors. The assembly consists of the cold plates (one cold plate for each processor module), copper tubing that connects 4 groups of 4 cold plates in series, copper tubing that connects each grouping of 4 cold plates, or quadrant, to a common set of supply and return headers, and two flexible EPDM hoses that connect the headers to system level manifolds in the rack housing the nodes (a rack can contain up to 14 nodes). Non-spill poppeted quick connects are used to connect the cold plate assembly to the system level manifolds. In addition to a detailed description of the cold plate assembly, an overview will be given of the analysis and design that went into its development. Conjugate computational fluid dynamics (CFD) modeling was done on the cold plate and processor module combination. CFD modeling was done on the headers to verify proper flow balancing. Finally, mechanical finite element analyses were performed to determine the cold plate tube routing necessary to minimize reactionary forces the tubes placed on the cold plates under land grid array loading of the module to the board.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	897
Ending Page	905
Page Count	9
File Format	PDF
ISBN	9780791843604
DOI	10.1115/InterPACK2009-89244
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Water Cooling Computational fluid dynamics Modeling Flow (dynamics) Design Manifolds Epdm rubber Tubing Plates (structures) Manufacturing Finite element analysis Copper
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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