NDLI: Comparative Study of Analytical Models to Predict Warpage in Microelectronics Packages

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Singh, Charandeep Kim, Yeonsung Park, Seungbae
Copyright Year	2014
Abstract	Warpage is a critical concern in the microelectronics industry for several decades. It is a root cause of failures during manufacturing processes such as open solder joints. Also the excessive warpage generates the delamination and die cracking which degrade the package reliability. Thus, the accurate estimation of package warpage is one of the important factors to improve the package reliability. The purpose of this study is to select the best analytical model for prediction of warpage of microelectronic packages. This paper compares the warpage prediction from corrected Suhir’s theory and classical laminate theory. Both analytical models can provide quick warpage estimation when package is subjected to thermal loading. The warpage evaluation was performed based on both analytical models and compared with the experimental result. Also a finite element analysis (FEA) was performed and the result was compared with analytical models. The digital image correlation (DIC) technique was employed to observe the real-time out-of-plane deformation of the test sample exposed to temperature loading. Three layer test vehicle having the die, underfill, and aluminum plate was assembled for this study. Underfill material properties were characterized with DIC and dynamic mechanical analysis (DMA). The result indicates that Laminate theory provides the better prediction of warpage when underfill layer thickness is comparable with die and substrate layer thickness. This study helps to design more reliable components with design parameters being optimized in early stage of the development using analytical solutions.
File Format	PDF
ISBN	9780791849590
DOI	10.1115/IMECE2014-38594
Volume Number	Volume 10: Micro- and Nano-Systems Engineering and Packaging
Conference Proceedings	ASME 2014 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2014-11-14
Publisher Place	Montreal, Quebec, Canada
Access Restriction	Subscribed
Subject Keyword	Aluminum plate Cracking (materials) Solder joints Temperature Deformation Warping Microelectronic devices Laminates Vehicles Design Fracture (process) Materials properties Finite element analysis Manufacturing Reliability Delamination Failure
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in