NDLI: Thermal and Thermomechanical Analysis of Custom Engineered Ag-Nanoparticle Thermal Interface Materials

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chhasatia, Viral Sun, Ying Zhou, Fan Huang, Liwei Wang, Howard
Copyright Year	2008
Abstract	Thermal interface material (TIM) is a major hurdle in heat flow for typical chip/heat sink assemblies. In many electronic devices, hot spots occur in areas of high activity during the device operation. These hot spots can lead to high thermal gradients, which in turn result in performance and reliability hindrances. The elevated, non-uniform power density confronted with conventional TIMs that contain a uniform layer of high thermal conductivity material for the entire chip can be extremely insufficient in many applications. In this paper, a custom engineered, Ag-nanoparticle (Ag-NP) TIM that targets directly to the high power density region is introduced for achieving better thermal-mechanical-electrical performance at a low cost. These nanoparticles can be inkjet printed on hot spots and sintered at a relative low temperature (∼120°C) to create a continuous metallic layer that is in good contact with both the chip and heat sink, whereas the conventional particle-laden TIM covers the lower power density area. A computational model is developed to examine the overall thermal performance and reliability of the hybrid Ag-NP/conventional TIM as a function of the bondline thickness, applied pressure, deposition pattern, and surface roughness. The results show great improvements compared with a high-performance indium solder.
Starting Page	1577
Ending Page	1586
Page Count	10
File Format	PDF
ISBN	9780791848715
DOI	10.1115/IMECE2008-68896
e-ISBN	9780791838402
Volume Number	Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C
Conference Proceedings	ASME 2008 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2008-10-31
Publisher Place	Boston, Massachusetts, USA
Access Restriction	Subscribed
Subject Keyword	Power density Solders Surface roughness Flow (dynamics) Pressure Thermomechanics Temperature gradient Nanoparticles Heat Particulate matter Thermal conductivity Reliability Heat sinks Low temperature
Content Type	Text
Resource Type	Article

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