NDLI: A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of Build-Up Approach to Thermal Analysis of a Benchmark Model

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Nakayama, Wataru Matsuki, Ryuichi Hacho, Yukari Yajima, Kiyoko
Copyright Year	2003
Abstract	Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the packaging designer fast and versatile searches for better design options. The most serious factor that slows the CFD-based design is geometric complexity created by various components packed in a tight space of the system box. In a proposed methodology coined ‘Build-up Approach (BUA)’ CFD simulations are conducted in advance of the start of actual hardware design to develop a body of temperature distribution solutions for possible components placements in the system box. Two algorithms are introduced before and after CFD simulations. One defines the geometric parameters through singular value decomposition (SVD) of components placement patterns, and the other identifies important geometric parameters for thermal management through application of the Taguchi method. A case study was conducted on a simple hardware model (benchmark model) that embodies essential features of portable electronic equipment. The results proved the effectiveness of these algorithms in measuring the relative importance of geometric parameters, and weeding out unimportant geometric details contained in actual equipment.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	603
Ending Page	614
Page Count	12
File Format	PDF
ISBN	0791837149
DOI	10.1115/IMECE2003-42181
Volume Number	Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
Conference Proceedings	ASME 2003 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2003-11-15
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	Cycles Temperature distribution Electronic equipment Computational fluid dynamics Design Algorithms Simulation Packaging Taguchi methods Thermal management Hardware Product development Thermal analysis
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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