NDLI: Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Ravi, S. Prasher Shipley, Jim Prstic, Suzana Koning, Paul Wang, Jin-Lin
Copyright Year	2003
Abstract	Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semi-empirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	431
Ending Page	439
Page Count	9
File Format	PDF
ISBN	0791837149
DOI	10.1115/IMECE2003-41034
Volume Number	Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
Conference Proceedings	ASME 2003 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2003-11-15
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	Viscosity Rheology Fillers (materials) Computer cooling Modeling Pressure Optimization Design Thermal resistance Particulate matter Materials properties Thermal conductivity Shapes Polymers Yield stress
Content Type	Text
Resource Type	Article

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