NDLI: Simulation-Aided Thermal Design of Intermittent Power Transistor Packages

Content Provider	IEEE Xplore Digital Library
Author	Xiao, Ying Dou, Xinyu Cai, Jian Feng, Tao
Copyright Year	2007
Description	Author affiliation: Electronic Packaging Technology R&D Center, RIIT, Tsinghua University. Email: xiao-y@mails.tsinghua.edu.cn (Xiao, Ying) \|\| Electronic Packaging Technology R&D Center, RIIT, Tsinghua University; Institute of Microelectronics, Tsinghua University (Cai, Jian) \|\| Electronic Packaging Technology R&D Center, RIIT, Tsinghua University (Dou, Xinyu; Feng, Tao)
Abstract	This study utilizes CFD simulation to assist design of package structures for intermittent-working last stage power transistors. Considering systems' intermittent features, the thermal analysis and simulation indicate that simplified package structures are feasible, which result in compact packages with conventional materials and processes, thus lower cost. The simulation includes cases for conduction-only and for conduction-convection combined effects. The results lead to the conclusion that convection can be neglected if the power-on duty cycle is extremely low.
Starting Page	89
Ending Page	92
File Size	3475718
Page Count	4
File Format	PDF
ISBN	1424410975
DOI	10.1109/EDST.2007.4289785
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-03
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	CFD Temperature Computational fluid dynamics Power system transients simulation Electronic packaging thermal management power transistor thermal design Radio frequency Industrial power systems Thermal resistance Power system simulation Power transistors transient thermal resistance Electronics packaging
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Multi-resolution Simulation and Design Tool For Thermal Management of Electronics Packages in Complex Systems

Hierarchical compact models for simulation of electronic chip packages

Application of a CFD tool for system-level thermal simulation

Optimization of packaging materials and design for thermal management in stacked-die packages

Fan swirl effects on cooling heat sinks and electronic packages

Thermal limits of flip chip package-experimentally validated, CFD supported case studies

Thermal design of a desktop computer system using CFD analysis

Modeling transient thermal response of pulsed power electronic packages

Thermal design of a high power telecommunication system using a CFD tool

Simulation-Aided Thermal Design of Intermittent Power Transistor Packages

Similar Documents

Multi-resolution Simulation and Design Tool For Thermal Management of Electronics Packages in Complex Systems

Hierarchical compact models for simulation of electronic chip packages

Application of a CFD tool for system-level thermal simulation

Optimization of packaging materials and design for thermal management in stacked-die packages

Fan swirl effects on cooling heat sinks and electronic packages

Thermal limits of flip chip package-experimentally validated, CFD supported case studies

Thermal design of a desktop computer system using CFD analysis

Modeling transient thermal response of pulsed power electronic packages

Thermal design of a high power telecommunication system using a CFD tool

Simulation-Aided Thermal Design of Intermittent Power Transistor Packages