NDLI: Thermal Model of a Thinned-Die Cooling System

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Boiadjieva, N. Koev, P.
Copyright Year	2003
Abstract	For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated [1]. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100° C for device power up to 150W was designed [2]. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3-D heat equation that governs the temperature distribution was simplified to a case of a 1-D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verify—the accuracy was better than 10% over the entire temperature and power ranges.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	553
Ending Page	557
Page Count	5
File Format	PDF
ISBN	0791837149
DOI	10.1115/IMECE2003-42034
Volume Number	Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology
Conference Proceedings	ASME 2003 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2003-11-15
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	1-d non-uniform rod Heat spreader Mathematical thermal model Ic cooling Flat heat pipes Temperature distribution Temperature Heat Air flow Cooling Cooling systems Computer cooling Silicon
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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