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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Lau, J. Erasmus, S. Golwalkar, S. Surratt, R. Boysan, P. |
| Copyright Year | 1992 |
| Abstract | The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element analysis. Temperature cycling results have been presented as a Weibull distribution, and an acceleration factor has been established for the failure rate at operating conditions. Thermal fatigue life of the corner solder joints has been estimated based on the calculated plastic strain, Coffin-Manson equation, and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made. Furthermore, failure analysis of the solder joints has been performed using Scanning Electron Microscopy (SEM) and an optical method. |
| Starting Page | 169 |
| Ending Page | 176 |
| Page Count | 8 |
| File Format | |
| ISSN | 10437398 |
| e-ISSN | 15289044 |
| Journal | Journal of Electronic Packaging |
| Volume Number | 114 |
| Issue Number | 2 |
| DOI | 10.1115/1.2906414 |
| Language | English |
| Publisher | The American Society of Mechanical Engineers |
| Publisher Date | 1992-06-01 |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Corners (Structural elements) Equations Failure Failure analysis Fatigue Fatigue life Finite element analysis Reliability Scanning electron microscopy Solder joints Solders Temperature Weibull distribution |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering Computer Science Applications Mechanics of Materials Electronic, Optical and Magnetic Materials |
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