NDLI: Electronic Materials and Structures for Multichip Modules

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Charles, H. K.
Copyright Year	1992
Abstract	Multichip modules are rapidly becoming a major thrust in electronic packaging technology. Because of the high density and high performance nature of the electronic devices packaged in multichip modules, stringent new demands are being placed on materials, interconnect, and packaging structures. A systematic review of the materials and material structures for multichip modules is presented along with their associated physical and electronic properties. Particular emphasis is placed on new materials and their potential impact on multichip module packaging. Examples of their use in the fabrication of multichip modules and advanced chip-on-board systems are described.
Starting Page	226
Ending Page	233
Page Count	8
File Format	PDF
ISSN	10437398
e-ISSN	15289044
Journal	Journal of Electronic Packaging
Volume Number	114
Issue Number	2
DOI	10.1115/1.2906422
Language	English
Publisher	The American Society of Mechanical Engineers
Publisher Date	1992-06-01
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Density Electronic packaging Manufacturing Multi-chip modules Packaging Thrust
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Computer Science Applications Mechanics of Materials Electronic, Optical and Magnetic Materials

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Electronic Materials and Structures for Multichip Modules