NDLI: Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Lau, John Erasmus, Steve
Copyright Year	1993
Abstract	The thermal and mechanical responses of a 304-Pin, 0.5 mm pitch, 40 mm by 40 mm body size plastic quad flat pack (QFP) solder joints and leads have been determined in this study. The thermal stress and strain in the leads and solder joints have been obtained by a 3-D nonlinear finite element method and the thermal fatigue life of the QFP corner solder joint was then estimated based on the calculated plastic strains, Coffin-Manson law, and isothermal fatigue data of solders. The effects of overload environmental stress factors on the mechanical responses of the leads and solder joints have been determined by bending and twisting experiments.
Starting Page	322
Ending Page	328
Page Count	7
File Format	PDF
ISSN	10437398
e-ISSN	15289044
Journal	Journal of Electronic Packaging
Volume Number	115
Issue Number	3
DOI	10.1115/1.2909335
Language	English
Publisher	The American Society of Mechanical Engineers
Publisher Date	1993-09-01
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Corners (Structural elements) Fatigue Fatigue life Finite element methods Reliability Solder joints Solders Stress Thermal stresses
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Computer Science Applications Mechanics of Materials Electronic, Optical and Magnetic Materials

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Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions