NDLI: Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	S.-M. Lee Stone, D. S.
Copyright Year	1992
Abstract	Room temperature, displacement-controlled tensile test and displacement-controlled tension/compression fatigue tests were performed on as-cast specimens of eutectic Pb-Sn solder with lamellar microstructure. A range of strain rates were used to identify how failure varies with strain rate. Under tensile loading at high strain rate (6.7 × 10−2 /s) failure was observed after about 20 percent strain. There was evidence of shear localization, and failure was transgranular with a dimpled fracture surface. The low strain rate (6.7 × 10−6 /s ) tensile specimen failed by cavitation. This cavitation coincided with sliding at boundaries between colonies of the eutectic (grain boundaries); there was little evidence of sliding in the high strain rate specimen. Two behaviors were observed in the fatigue tests. At low frequency and high strain range (2 × 10−3 /s, 4 percent, Nf ≈ 300−1000) numerous intergranular cracks initiated at the surface, eventually linking up and propagating along grain boundaries to the interior. What appeared to be fatigue striations were found on the crack face. At high frequency and low strains (>0.1/s, <1 percent) transgranular failure dominated.
Starting Page	118
Ending Page	121
Page Count	4
File Format	PDF
ISSN	10437398
e-ISSN	15289044
Journal	Journal of Electronic Packaging
Volume Number	114
Issue Number	2
DOI	10.1115/1.2906407
Language	English
Publisher	The American Society of Mechanical Engineers
Publisher Date	1992-06-01
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Cavitation Compression Deformation Displacement Failure Fatigue Fatigue testing Fracture (Process) Grain boundaries Shear (Mechanics) Solders Temperature Tension
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Computer Science Applications Mechanics of Materials Electronic, Optical and Magnetic Materials

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