NDLI: Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction (SLIP '10)

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Modeling NoC traffic locality and energy consumption with rent's communication probability distribution

Application of 3-D ICs to FPGAs

Advances in PCB routing

SLIP: 10 years ago and 10 years from now

Performance prediction of throughput-centric pipelined global interconnects with voltage scaling

Future of interconnect fabric: a contrarian view

Hybrid network on chip (HNoC): local buses with a global mesh architecture

Process-induced skew variation for scaled 2-D and 3-D ICs

Simulation based study of wireless RF interconnects for practical CMOs implementation

Fast, accurate a priori routing delay estimation

Through-silicon-via-aware delay and power prediction model for buffered interconnects in 3D ICs

On-chip em-sensitive interconnect structures

Application of generalized scattering matrix for prediction of power supply noise

Analysis of high-performance clock networks with RLC and transmission line effects

Worst-case performance prediction under supply voltage and temperature variation

3-2-1 contact: an experimental approach to the analysisof contacts in 45 nm and below

Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction (SLIP '10)

Content Provider	ACM Digital Library
Editor	Wang, Janet Reda, Sherief
Copyright Year	2010
Abstract	On behalf of the organizing committee, we would like to welcome you to the 12th ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP'10), held on Sunday June 13th 2010. This year SLIP is co-located with Design Automation Conference (DAC) at the Anaheim Convention Center, Anaheim, CA, USA. The SLIP workshop focuses on modeling and predicting the characteristics of interconnect systems together with their impact on system performance. After a rigorous review process, the program committee has selected eleven papers out of seventeen contributed papers (acceptance rate 64%) and an additional two invited papers for publication in the proceedings and oral presentations at the SLIP'10 workshop. The topics of selected papers cover: (i) new modeling and analysis techniques for networks on chips; (ii) interconnect modeling techniques for 3D integration; (iii) interconnect prediction techniques for emerging on-chip RF and transmission-line interconnects; and (iv) new ideas for classical interconnect estimation problems. In addition to the contributed papers, SLIP'10 features a keynote address by Shekhar Borkar, the director of the microprocessor technology laboratory at Intel Corporation. The keynote speech titled "Future of Interconnect Fabric -- A Contrarian View" will highlight the main interconnect challenges in future manycore processors. SLIP'10 also features two invited talks. The first talk by Professor Martin Wong from University of Illinois, Urbana-Champaign gives an overview of advanced high-speed PCB routing techniques, and the second talk by Dr. Peter Suaris from TierLogic addresses interconnect challenges in 3D FPGAs. In addition, a special panel titled "10 Years Ago and 10 Years Ahead" moderated by Professor Andrew B. Kahng from University of California, San Diego, include the following panelists: Professor Dirk Stroobandt from Ghent University, Belgium, Dr. Patrick Groeneveld from Magma Corporation, and Dr. Lou Scheffer from Howard Hughes Medical Institute, Ashburn, VA. The panel will reflect on SLIP research in the previous 10 years and predict its course over the next 10 years. Following SLIP'09 footsteps, we are having in SLIP'10 15 -- 20 minute discussion panels that follow every session. Each discussion panel is comprised of experts who will stimulate workshop discussions and will provide further remarks and insights into the presented papers. The panel will engage the attendees in discussions that evaluate the papers from the big perspective of the session scope. The discussion panels will also contemplate the open research problems and challenges that fit within the session topic.
ISBN	9781450300377
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2010-06-13
Access Restriction	Subscribed
Content Type	Text
Resource Type	Conference Proceedings

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