NDLI: A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy

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A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy

Content Provider	ACM Digital Library
Author	Banerjee, Kaustav Loi, Gian Luca Agrawal, Banit Srivastava, Navin Sherwood, Timothy Lin, Sheng-Chih
Abstract	Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several other advantages, it is expected that the benefits from this technology can potentially be off-set by thermal considerations which impact chip performance and reliability. The work presented in this paper is the first attempt to study the performance benefits of 3-D technology under the influence of such thermal constraints. Using a processor-cache-memory system and carefully chosen applications encompassing different memory behaviors, the performance of 3-D architecture is compared with a conventional planar (2-D) design. It is found that the substantial increase in memory bus frequency and bus width contribute to a significant reduction in execution time with a 3-D design. It is also found that increasing the clock frequency translates into larger gains in system performance with 3-D designs than for planar 2-D designs in memory intensive applications. The thermal profile of the vertically stacked chip is generated taking into account the highly temperature sensitive leakage power dissipation. The maximum allowed operating frequency imposed by temperature constraint is shown to be lower for 3-D than for 2-D designs. In spite of these constraints, it is shown that the 3-D system registers large performance improvement for memory intensive applications.
Starting Page	991
Ending Page	996
Page Count	6
File Format	PDF
ISBN	1595933816
DOI	10.1145/1146909.1147160
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2006-07-24
Publisher Place	New York
Access Restriction	Subscribed
Subject Keyword	3d ics Processor-memory Vlsi Performance modeling Thermal analysis Three dimensional Vertical integration
Content Type	Text
Resource Type	Article

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