NDLI: PicoServer:using 3D stacking technology to enable a compact energy efficient chip multiprocessor (CARN, Vol. 34, Issue. 5)

Content Provider	ACM Digital Library
Author	Kgil, Taeho Saidi, Ali Mudge, Trevor Reinhardt, Steven D'Souza, Shaun Binkert, Nathan Dreslinski, Ronald Flautner, Krisztian
Abstract	In this paper, we show how 3D stacking technology can be used to implement a simple, low-power, high-performance chip multiprocessor suitable for throughput processing. Our proposed architecture, PicoServer, employs 3D technology to bond one die containing several simple slow processing cores to multiple DRAM dies sufficient for a primary memory. The 3D technology also enables wide low-latency buses between processors and memory. These remove the need for an L2 cache allowing its area to be re-allocated to additional simple cores. The additional cores allow the clock frequency to be lowered without impairing throughput. Lower clock frequency in turn reduces power and means that thermal constraints, a concern with 3D stacking, are easily satisfied.The PicoServer architecture specifically targets Tier 1 server applications, which exhibit a high degree of thread level parallelism. An architecture targeted to efficient throughput is ideal for this application domain. We find for a similar logic die area, a 12 CPU system with 3D stacking and no L2 cache outperforms an 8 CPU system with a large on-chip L2 cache by about 14% while consuming 55% less power. In addition, we show that a PicoServer performs comparably to a Pentium 4-like class machine while consuming only about 1/10 of the power, even when conservative assumptions are made about the power consumption of the PicoServer.
Starting Page	117
Ending Page	128
Page Count	12
File Format	PDF
ISSN	01635964
DOI	10.1145/1168919.1168873
Journal	ACM SIGARCH Computer Architecture News (CARN)
Volume Number	34
Issue Number	5
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	1981-04-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Chip multiprocessor Full-system simulation 3d stacking technology Tier 1 server Low power Web/file/streaming server
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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