NDLI: Effect of deuterium on thin-film formation during tungsten sputtering in magnetron discharge deuterium plasma

Content Provider	Springer Nature Link
Author	Sharapov, V. M. Zimin, A. M. Krivitsky, S. E. Serushkin, S. V. Zalavutdiv, R. Kh. Kulikauskas, V. S.
Copyright Year	2015
Abstract	The features of the formation of tungsten-deuterium films on a silicon substrate during the sputtering of a tungsten target in magnetron discharge deuterium plasma are studied. Scanning electron microscopy reveals the presence of blistered regions on the surface of the film; the concentration of these regions depends on the target-substrate distance. This distance is also responsible for the concentration of deuterium trapped in the films, which is determined by elastic recoil detection analysis. It is assumed that the deuterium retained by the film is located in pores and surface blisters that form the observed bulged regions. A possible cause of the formation of blisters and pores is the low solubility of deuterium in the Si substrate and the W film.
Starting Page	673
Ending Page	678
Page Count	6
File Format	PDF
ISSN	10274510
Journal	Journal of Surface Investigation. X-ray, Synchrotron and Neutron Techniques
Volume Number	9
Issue Number	4
e-ISSN	18197094
Language	English
Publisher	Pleiades Publishing
Publisher Date	2015-08-06
Publisher Place	Moscow
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	deuterium tungsten codeposited films accumulation of hydrogen isotopes magnetron discharge elastic recoil detection Surfaces and Interfaces, Thin Films
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Surfaces, Coatings and Films

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