NDLI: Microstructural development in asymmetric processing of tantalum plate

Content Provider	Springer Nature Link
Author	Field, D. P. Yanke, J. M. Mcgowan, E. V. Michaluk, C. A.
Copyright Year	2005
Abstract	Sputtered tantalum (Ta) and TaN are employed as barrier layers in modern integrated circuits to enable reliable use of Cu as an interconnect material. The directional properties of sputtering Ta can result in nonuniform film thicknesses (from heavily textured plate) and unpredictable sputtering rates (from plates with through thickness texture gradients). This results in film thicknesses larger than necessary because of the sputtering being unpredictable. This presentation reports on an effort to increase textural and grain size uniformity in Ta by deforming the plate under conditions that simulate asymmetric rolling. This is accomplished by using a channel die configuration with uneven friction on the top and bottom plates so that a strong shear component is added to the plane strain condition enforced by the channel dies. Results indicate a trend towards less severe texture banding and more uniform structure in the plate processed by asymmetric friction conditions.
Starting Page	1521
Ending Page	1525
Page Count	5
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	34
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2005-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Sputtering Ta plate texture Si Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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